Dissolution and Dissolution Bonding: The Science of Dissolution Bonding Formation and Key Programmes

Dissolution and SolubilityThe Science of Joint Formation and Important Programmes

In the world of solvent cementing and other solvent cementing methods, "solvent cementing" is an important physicochemical process that directly influences the strength and reliability of a solvent cementing head. There are many people who misunderstand the term "dissolution bonding", but the term "dissolution", "diffusion", and "high level of proximity" are also used in dissolution bonding. This paper is based on the science of dissolution and fusion.

I. What is the meaning of "dissolution" in relation to dissolution?
In the context of dissolution, the word "dissolution" has the usual, secondary meaning:

Mutual dissolution of base material and HANDA: In the case of melt and dissolution, when the surface of a solid base material interacts with a molten HANDA (or ferrite matrix), the atoms of the base material dissolve in the liquid HANDA, the atoms of the HANDA spread out from the base material, and a migration layer is formed that changes in composition slowly.

Dissolution and removal of acid film: In the welding of aluminium and steels, an important part of the cutting of fluxes is the dissolution of the acid film on the surface of the base material and its removal, so that a good bonding of the pure metal surface can be achieved.

II. Concrete bonding programmes based on the principle of "dissolution".
Dissolving - Thorough dissolving and re-solidifying

Prospect: The melting section (base material and melted material) is heated up and a common melting plan is formed. In this melting pool, dissolved and mixed different metal elements are completely dissolved, cooled down, and new homogeneous melted metal crystals are formed.

Application: MIG/MAG bonding, TIG bonding, laser bonding. Suitable for joining of high strength structural parts.

ろう付け-Precision capillary dissolution bonding

Project: The base material is dissolved, the melting point of the low いろう材(Copper, Silver)みをheatして溶かす。 The dissolved material is buried in the gap by the capillary phenomenon, and a strong metal bond is formed between the surface of the base material and the wakana dissolution and diffusion.

Application: Air conditioner, circuit board, super hard cutting tools, jewellery. It is suitable for the connection of different materials with precision.

III. Is it important to funk the "dissolution"?
Unsuitable dissolution may result in significant dissolution failures:

Excessive dissolution: The formation of brittle intermetallic compounds in the base material or the formation of baines in the base material will result in the formation of a weak joint, and the strength of the joint will be lowered.

Insufficient dissolution: HANDAGA is strongly bonded to the base material and mechanically bonded to the base material.

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